Electronics & Semiconductor Should Cost Rapid should-cost assessment for semiconductors, MCU/ASIC, sensors, power electronics, PCB/PCBA, connectors and passive components. Build cost logic based on wafer process, die size, yield, packaging, testing, PCB technology and SMT assembly. Develop reusable calculation models and challenge supplier quotations with fact-based cost drivers. Quotation & Sourcing Support Set competitive electronic BOM targets, including piece price, NRE/tooling and productivity assumptions. Support supplier negotiation, localization, second source and technology scenario evaluation. Track target achievement and drive cost-gap closure with R&D, Purchasing and Product Management.   Design to Value Participate early in concept and design phases and translate customer needs and market trends into target functions and allowable cost. Identify over-specification, unnecessary complexity and low-value features. Drive DtV, DtC and Re-DtC activities and evaluate architecture and performance-cost trade-offs.   Benchmark & Competence Building Lead electronics tear-down and competitor cost benchmarking. Build China/Asia electronics market intelligence, supplier knowledge and cost databases. Transfer China insights and best practices to Asia and selected global projects. Electronics & Semiconductor Should Cost Rapid should-cost assessment for semiconductors, MCU/ASIC, sensors, power electronics, PCB/PCBA, connectors and passive components. Build cost logic based on wafer process, die size, yield, packaging, testing, PCB technology and SMT assembly. Develop reusable calculation models and challenge supplier quotations with fact-based cost drivers. Quotation & Sourcing Support Set competitive electronic BOM targets, including piece price, NRE/tooling and productivity assumptions. Support supplier negotiation, localization, second source and technology scenario evaluation. Track target achievement and drive cost-gap closure with R&D, Purchasing and Product Management.   Design to Value Participate early in concept and design phases and translate customer needs and market trends into target functions and allowable cost. Identify over-specification, unnecessary complexity and low-value features. Drive DtV, DtC and Re-DtC activities and evaluate architecture and performance-cost trade-offs.   Benchmark & Competence Building Lead electronics tear-down and competitor cost benchmarking. Build China/Asia electronics market intelligence, supplier knowledge and cost databases. Transfer China insights and best practices to Asia and selected global projects.